Invention Grant
- Patent Title: Method of measuring adhesive strength
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Application No.: US17182707Application Date: 2021-02-23
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Publication No.: US11668642B2Publication Date: 2023-06-06
- Inventor: Han Ho Park , Hyung-Don Na , Kyung Jun Park , Eun Ji Park , Chang Seob Jung , Hyeon Deuk Hwang
- Applicant: Samsung Display Co., Ltd.
- Applicant Address: KR Yongin-Si
- Assignee: SAMSUNG DISPLAY CO., LTD.
- Current Assignee: SAMSUNG DISPLAY CO., LTD.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Cantor Colburn LLP
- Priority: KR 20200062404 2020.05.25
- Main IPC: G01N19/04
- IPC: G01N19/04

Abstract:
A method of measuring adhesive strength includes setting an evaluation time (te), fixing a substrate and an adhesive member to a measurement device, pulling the adhesive member fixed to the measurement device with a first measurement force (Fe1) for the evaluation time (te), pulling the adhesive member fixed to the measurement device is pulled with a second measurement force (Fe2), which is obtained by increasing the first measurement force (Fe1) by a preset amount, for the evaluation time (te), and determining a reference measurement force (Fes) which is a static force applied to the adhesive member when a distance by which a first portion of the adhesive member is detached from the substrate is equal to a preset distance (dt) is determined.
Public/Granted literature
- US20210364416A1 METHOD OF MEASURING ADHESIVE STRENGTH Public/Granted day:2021-11-25
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