Invention Grant
- Patent Title: Contact and socket device for burning-in and testing semiconductor IC
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Application No.: US17551007Application Date: 2021-12-14
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Publication No.: US11668744B2Publication Date: 2023-06-06
- Inventor: Dong Weon Hwang , Logan Jae Hwang , Jae Baek Hwang
- Applicant: HICON CO., LTD. , Dong Weon Hwang , Logan Jae Hwang , Jae Baek Hwang
- Applicant Address: KR CA Seongnam-si
- Assignee: HICON CO., LTD.,Dong Weon Hwang,Logan Jae Hwang,Jae Baek Hwang
- Current Assignee: HICON CO., LTD.,Dong Weon Hwang,Logan Jae Hwang,Jae Baek Hwang
- Current Assignee Address: KR CA Seongnam-si
- Priority: KR 20200178794 2020.12.18
- Main IPC: G01R31/28
- IPC: G01R31/28 ; H01L21/66

Abstract:
A contact for burning-in and testing a semiconductor IC and a socket device including the contact are proposed. The contact includes: an upper terminal part (111) having an upper tip part (111b) at an upper end part thereof; a lower terminal part (112) having a lower tip part (112c) at a lower end part thereof and provided on the same axis as the upper terminal part (111); and an elastic part (113) elastically supporting the upper terminal part (111) and the lower terminal part (112), wherein the upper terminal part (111) and the lower terminal part (112) include a shoulder part (111a) and a shoulder part (112a), respectively, formed by protruding therefrom in width directions thereof, and the elastic part (113) has a third width (w3), and includes a first strip (113a) and a second strip (113b).
Public/Granted literature
- US20220196727A1 CONTACT AND SOCKET DEVICE FOR BURNING-IN AND TESTING SEMICONDUCTOR IC Public/Granted day:2022-06-23
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