Invention Grant
- Patent Title: Probe apparatus having a track and wafer inspection method using the same
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Application No.: US17690133Application Date: 2022-03-09
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Publication No.: US11668745B1Publication Date: 2023-06-06
- Inventor: Yi-Ju Chen , Jui-Hsiu Jao
- Applicant: NANYA TECHNOLOGY CORPORATION
- Applicant Address: TW New Taipei
- Assignee: NANYA TECHNOLOGY CORPORATION
- Current Assignee: NANYA TECHNOLOGY CORPORATION
- Current Assignee Address: TW New Taipei
- Agent Xuan Zhang
- Main IPC: G01R31/26
- IPC: G01R31/26 ; G01R31/28 ; G01R1/02 ; G01R1/04 ; G01R1/067 ; G01R1/073
Abstract:
A probe apparatus and a wafer inspection method are provided. The probe apparatus includes a chuck configured to support a wafer, a track surrounding the chuck, a tester disposed on the track and having a probe, and a processing unit in communication with the tester and configured to move the tester circumferentially around the wafer such that the probe is moved from a first portion on the wafer to a second portion on the wafer.
Information query
