Invention Grant
- Patent Title: Neural network thermal behavior predictions
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Application No.: US16761834Application Date: 2017-12-13
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Publication No.: US11669057B2Publication Date: 2023-06-06
- Inventor: Jun Zeng , He Luan
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Spring
- Agency: Shook, Hardy & Bacon L.L.P.
- International Application: PCT/US2017/066047 2017.12.13
- International Announcement: WO2019/117886A 2019.06.20
- Date entered country: 2020-05-06
- Main IPC: G05B13/02
- IPC: G05B13/02 ; B33Y10/00

Abstract:
Examples of a thermal behavior prediction method are described herein. In some examples of the thermal behavior prediction method, a predicted heat map of a layer corresponding to a three-dimensional (3D) model is computed using at least one neural network. The predicted heat map is computed based on a contone map corresponding to the 3D model.
Public/Granted literature
- US20210200187A1 THERMAL BEHAVIOR PREDICTION FROM A CONTONE MAP Public/Granted day:2021-07-01
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