Invention Grant
- Patent Title: Controller with distributed sequencer components
-
Application No.: US17301044Application Date: 2021-03-23
-
Publication No.: US11669275B2Publication Date: 2023-06-06
- Inventor: Jiangli Zhu , Cheng Yuan Wu , Ying Yu Tai
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Lowenstein Sandler LLP
- Main IPC: G06F3/06
- IPC: G06F3/06

Abstract:
A host operation to be performed can be received. Sub-operations that are associated with the received host operation can be determined. A memory component of multiple memory components can be identified for each sub-operation. Furthermore, each sub-operation can be transmitted to a media sequencer component that is associated with a respective memory component of the memory components.
Public/Granted literature
- US20210208820A1 CONTROLLER WITH DISTRIBUTED SEQUENCER COMPONENTS Public/Granted day:2021-07-08
Information query