- Patent Title: Transparent conducting film laminate and processing method thereof
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Application No.: US17615429Application Date: 2019-12-24
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Publication No.: US11670433B2Publication Date: 2023-06-06
- Inventor: Shigeru Yamaki , Shuhei Yoneda
- Applicant: SHOWA DENKO K.K.
- Applicant Address: JP Tokyo
- Assignee: SHOWA DENKO K.K.
- Current Assignee: SHOWA DENKO K.K.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP 2019114964 2019.06.20
- International Application: PCT/JP2019/050513 2019.12.24
- International Announcement: WO2020/255458A 2020.12.24
- Date entered country: 2021-11-30
- Main IPC: H01B1/22
- IPC: H01B1/22 ; B32B27/08 ; B32B27/32 ; B32B27/36 ; C09J7/29 ; C09D163/00 ; C09D175/04 ; H01B5/14

Abstract:
Provided are a transparent conducting film laminate to which a curl generated during a heating step and after the heating step can be controlled, and a method for processing the same. A transparent conducting film laminate comprises a transparent conducting film 20 and a carrier film 10 stacked thereon, wherein the transparent conducting film 20 comprises a transparent resin film 3, transparent conducting layer 4, and an overcoat layer 5 stacked in this order, the transparent resin film 3 having a thickness T1 of 5 to 25 μm and being made of an amorphous cycloolefin-based resin, the carrier film 10 is releasably stacked on the other main face, the face opposite to the face having the transparent conducting layer 4, of the transparent resin film 3 with an adhesive agent layer 2 therebetween, and a protection film 1 has a thickness T2 which is 5 times or more of the thickness T1 of the transparent resin film 3 and is 150 μm or less, and is made of polyester having an aromatic ring in its molecular backbone.
Public/Granted literature
- US11710581B2 Transparent conducting film laminate and processing method thereof Public/Granted day:2023-07-25
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