Invention Grant
- Patent Title: Hybrid cabling solution for higher bandwidth and millimeter wave applications
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Application No.: US17226491Application Date: 2021-04-09
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Publication No.: US11670435B2Publication Date: 2023-06-06
- Inventor: Sidharth S. Dalmia , Kiranjit Dhaliwal
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Aikin & Gallant, LLP
- Main IPC: H01B7/08
- IPC: H01B7/08 ; H01B7/04 ; H01B9/00 ; H01B11/18

Abstract:
Flexible cables may include multiple power, ground, and signal traces, and include EM interference suppression devices within the cable itself. Signal traces may be shielded by ground traces. The body of a cable may be divided into lateral portions through which different types of traces extend. One lateral side of a cable body may include a stack of power traces, while another lateral side of the cable body may include ground and signal traces. EBG patterns may be incorporated into ground traces. Capacitors may be positioned within the cable along its length, mounted between power and ground traces, for decoupling.
Public/Granted literature
- US20220328212A1 HYBRID CABLING SOLUTION FOR HIGHER BANDWIDTH AND MILLIMETER WAVE APPLICATIONS Public/Granted day:2022-10-13
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