Invention Grant
- Patent Title: Substrate processing method and substrate processing device
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Application No.: US17262807Application Date: 2019-07-04
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Publication No.: US11670517B2Publication Date: 2023-06-06
- Inventor: Sei Negoro , Kenji Kobayashi
- Applicant: SCREEN Holdings Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Ostrolenk Faber LLP
- Priority: JP 2018163796 2018.08.31 JP 2019075345 2019.04.11
- International Application: PCT/JP2019/026609 2019.07.04
- International Announcement: WO2020/044789A 2020.03.05
- Date entered country: 2021-01-25
- Main IPC: H01L21/3213
- IPC: H01L21/3213 ; H01L21/02 ; H01L21/3205 ; H01L21/67 ; H01L21/687

Abstract:
An alkaline etchant containing a quaternary ammonium hydroxide, water, and an inhibitory substance for inhibiting contact between hydroxide ions generated from the quaternary ammonium hydroxide and objects P1 to P3 to be etched is prepared. The prepared etchant is supplied to a substrate in which the polysilicon-containing objects P1 to P3 to be etched and objects O1 to O3 not to be etched, which are different from the objects P1 to P3 to be etched, are exposed, thereby etching the objects P1 to P3 to be etched while preventing the objects O1 to O3 not to be etched from being etched.
Public/Granted literature
- US20210313191A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE Public/Granted day:2021-10-07
Information query
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