An electronic component mounting device is provided for mounting a plurality of electronic components, the plurality of the electronic component being placed in a predetermined portion, on a plurality of attachments each arranged at a predetermined interval from one another. The electronic component mounting device includes a removal mechanism for removing some of the plurality of the electronic components having been placed in the predetermined portion, a transport mechanism for transporting the electronic components removed by the removal mechanism, moving the electronic components so that intervals between the electronic components adjacent to one another are, respectively, the predetermined interval before reaching the attachments, and transporting the electronic components to the attachments, and a mounting and transfer mechanism for mounting the electronic components, which have been transported by the transport mechanism, on predetermined positions of the attachments.