Invention Grant
- Patent Title: Thermal interface material, method for thermally coupling with thermal interface material, and method for preparing thermal interface material
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Application No.: US16483391Application Date: 2018-01-30
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Publication No.: US11670566B2Publication Date: 2023-06-06
- Inventor: Mutsuaki Murakami , Atsushi Tatami , Masamitsu Tachibana
- Applicant: KANEKA CORPORATION
- Applicant Address: JP Osaka
- Assignee: KANEKA CORPORATION
- Current Assignee: KANEKA CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Osha Bergman Watanabe & Burton LLP
- Priority: JP 2017017697 2017.02.02
- International Application: PCT/JP2018/002957 2018.01.30
- International Announcement: WO2018/143190A 2018.08.09
- Date entered country: 2019-08-02
- Main IPC: C01B32/205
- IPC: C01B32/205 ; H01L23/373 ; C09J7/29 ; C09J201/00 ; H05K7/20
Abstract:
A thermal interlace material for transferring heat by interposing between two materials may include a graphite film. The graphite film may have a thickness T of 200 nm to 3 μm, and a ratio Ra/T of an arithmetic average roughness Ra on a surface of the graphite film to the thickness T of the graphite film, may be 0.1 to 30.
Public/Granted literature
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