Invention Grant
- Patent Title: Electronic package
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Application No.: US17233885Application Date: 2021-04-19
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Publication No.: US11670607B2Publication Date: 2023-06-06
- Inventor: Chih-Hsien Chiu , Wen-Jung Tsai , Chia-Chu Lai
- Applicant: SILICONW ARE PRECISION INDUSTRIES CO., LTD.
- Applicant Address: TW Taichung
- Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Current Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Current Assignee Address: TW Taichung
- Agency: Kelly & Kelley, LLP
- Priority: TW 0105521 2021.02.18
- Main IPC: H01L23/66
- IPC: H01L23/66 ; H01Q1/22 ; H01Q1/24 ; H01Q9/04 ; H01L23/31 ; H01L23/498 ; H01L23/552 ; H01L23/00

Abstract:
An electronic package is provided, including at least an electronic element and at least an antenna structure disposed on a carrier structure. The antenna structure includes a base portion configured with an antenna body and a plurality of support portions disposed on the base portion. As such, the base portion is disposed over the carrier structure through the support portions and a plurality of open areas are formed between the base portion and the carrier structure to serve as an air gap, thereby effectively improving the performance gain and efficiency of the antenna body.
Public/Granted literature
- US20220262747A1 ELECTRONIC PACKAGE Public/Granted day:2022-08-18
Information query
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