Invention Grant
- Patent Title: Arrangement with central carrier and two opposing layer stacks, component carrier and manufacturing method
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Application No.: US17247504Application Date: 2020-12-14
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Publication No.: US11670613B2Publication Date: 2023-06-06
- Inventor: Mikael Tuominen , Nick Xin , Seok Kim Tay
- Applicant: AT&S (China) Co. Ltd.
- Applicant Address: CN Shanghai
- Assignee: AT&S (China) Co. Ltd.
- Current Assignee: AT&S (China) Co. Ltd.
- Current Assignee Address: CN Shanghai
- Agency: Smith Tempel Blaha LLC
- Agent Robert A. Blaha
- Priority: CN 1911412392.1 2019.12.31
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L23/00 ; H01L25/065
Abstract:
An arrangement, a method of manufacturing component carriers and a component carrier are provided. The arrangement includes a central carrier structure having a front side and a back side, a first layer stack having a first surface structure made of another material than the interior of the first layer stack and covered by a first release layer which is attached to the front side, and a second layer stack covered by a second release layer which is attached to the back side.
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Information query
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