Invention Grant
- Patent Title: Sensor chip and electronic device
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Application No.: US17600674Application Date: 2020-03-16
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Publication No.: US11670649B2Publication Date: 2023-06-06
- Inventor: Shinichiro Yagi , Yusuke Otake , Kyosuke Ito
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: Sheridan Ross P.C.
- Priority: JP 2019073485 2019.04.08
- International Application: PCT/JP2020/011368 2020.03.16
- International Announcement: WO2020/209009A 2020.10.15
- Date entered country: 2021-10-01
- Main IPC: H01L27/14
- IPC: H01L27/14 ; H01L27/146 ; G01S17/894 ; G01S7/4863 ; H04N25/79 ; H04N25/702

Abstract:
A sensor chip and an electronic device with SPAD pixels each including an avalanche photodiode element. The sensor chip includes a pixel area having an array of pixels, an avalanche photodiode element that amplifies a carrier by a high electric field area provided for the each of the pixels, an inter-pixel separation section that insulates and separates each of the pixels from adjacent pixels, and a wiring in a wiring layer laminated on a surface opposite to a light receiving surface of the semiconductor substrate that covers at least the high electric field area. The pixel array includes a dummy pixel area located near a peripheral edge of the pixel area. A cathode and an anode electric potential of the avalanche photodiode element arranged in the dummy pixel area are the same, or at least one of the cathode and anode electric potential is in a floating state.
Public/Granted literature
- US20220181366A1 SENSOR CHIP AND ELECTRONIC DEVICE Public/Granted day:2022-06-09
Information query
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