Invention Grant
- Patent Title: Manufacturing method of package
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Application No.: US17327790Application Date: 2021-05-24
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Publication No.: US11670670B2Publication Date: 2023-06-06
- Inventor: Wen-Shiang Liao , Chih-Hang Tung
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- The original application number of the division: US16354142 2019.03.14
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L49/02 ; H01L23/31 ; H01L23/498 ; H01F27/24 ; H01F27/28 ; H01L23/00 ; H01L21/48 ; H01L21/56 ; H01L21/683 ; H01F41/04
Abstract:
A manufacturing method of a package includes at least the following steps. A carrier is provided. An inductor is formed over the carrier. The inductor includes a first portion, a second portion, and a third portion. The first portion is parallel to the third portion, and the second portion connects the first portion and the third portion. A die is placed over the carrier. The die is surrounded by the inductor. An encapsulant is formed between the first portion and the third portion of the inductor. The encapsulant laterally encapsulates the die and the second portion of the inductor.
Public/Granted literature
- US20210280668A1 MANUFACTURING METHOD OF PACKAGE Public/Granted day:2021-09-09
Information query
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