Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US17353606Application Date: 2021-06-21
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Publication No.: US11670697B2Publication Date: 2023-06-06
- Inventor: Hsin-Che Chiang , Ju-Yuan Tzeng , Chun-Sheng Liang , Chih-Yang Yeh , Shu-Hui Wang , Jeng-Ya David Yeh
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L29/66 ; H01L29/78 ; H01L29/49 ; H01L21/28 ; H01L21/768 ; H01L23/528 ; H01L23/532 ; H01L29/165 ; H01L29/51

Abstract:
A semiconductor device includes a substrate comprising a semiconductor fin, a gate structure over the semiconductor fin, and source/drain structures over the semiconductor fin and on opposite sides of the gate structure. The gate stack comprises a high-k dielectric layer; a first work function metal layer over the high-k dielectric layer; an oxide of the first work function metal layer over the first work function metal layer; and a second work function metal layer over the oxide of the first work function metal layer, in which the first and second work function metal layers have different compositions; and a gate electrode over the second work function metal layer.
Public/Granted literature
- US20210313437A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2021-10-07
Information query
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