Invention Grant
- Patent Title: Semiconductor device
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Application No.: US17211469Application Date: 2021-03-24
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Publication No.: US11670700B2Publication Date: 2023-06-06
- Inventor: Young-Kwan Kim , Hyuck Joon Kwon , Jae Beom Jeon
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: F. Chau & Associates, LLC
- Priority: KR 20200094189 2020.07.29
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L23/544 ; H10B12/00 ; H10B10/00 ; H01L29/423 ; H01L27/108 ; H01L27/11 ; H10B41/50 ; H01L27/11548

Abstract:
A semiconductor memory element is provided. The semiconductor memory element includes a substrate including a memory cell region and a peripheral circuit region, an active region located in the memory cell region, a gate pattern buried in the active region, a conductive line disposed on the gate pattern, a first region including a plurality of peripheral elements placed in the peripheral circuit region, a dummy pattern buried in the peripheral circuit region, and a second region which includes the dummy pattern and does not overlap the first region.
Public/Granted literature
- US20220037508A1 SEMICONDUCTOR DEVICE Public/Granted day:2022-02-03
Information query
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