Invention Grant
- Patent Title: Semiconductor device structure with inner spacer
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Application No.: US17688305Application Date: 2022-03-07
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Publication No.: US11670718B2Publication Date: 2023-06-06
- Inventor: Sai-Hooi Yeong , Chi-On Chui , Chien-Ning Yao
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/06 ; H01L29/66 ; H01L29/423

Abstract:
A semiconductor device structure is provided. The semiconductor device structure includes a substrate having a base and a fin over the base. The semiconductor device structure also includes a first nanostructure over the fin and a second nanostructure over the first nanostructure. The semiconductor device structure further includes a gate stack wrapping around an upper portion of the fin, the first nanostructure, and the second nanostructure. In addition, the semiconductor device structure includes a first inner spacer between the fin and the first nanostructure and a second inner spacer between the first nanostructure and the second nanostructure. The semiconductor device structure includes a first low dielectric constant structure in the first inner spacer and a second low dielectric constant structure in the second inner spacer. The first low dielectric constant structure is larger than the second low dielectric constant structure.
Public/Granted literature
- US20220190162A1 SEMICONDUCTOR DEVICE STRUCTURE WITH INNER SPACER Public/Granted day:2022-06-16
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