Invention Grant
- Patent Title: Dielectric and thin film floating metal stacking for embedded tunable filtering of high frequency signals
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Application No.: US17241820Application Date: 2021-04-27
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Publication No.: US11670828B1Publication Date: 2023-06-06
- Inventor: Orion Davies , Altin E. Pelteku , Jonathan A. Lovseth
- Applicant: Rockwell Collins, Inc.
- Applicant Address: US IA Cedar Rapids
- Assignee: Rockwell Collins, Inc.
- Current Assignee: Rockwell Collins, Inc.
- Current Assignee Address: US IA Cedar Rapids
- Agency: Suiter Swantz pc llo
- Main IPC: H01P1/203
- IPC: H01P1/203 ; H01P1/202

Abstract:
A filter apparatus is disclosed. The filter apparatus may include a plurality of dielectric layers. The plurality of dielectric layers may include one or more first dielectric layers formed of a first dielectric material and one or more second dielectric layers formed of a second dielectric material. The second dielectric material of the one or more second dielectric layers being different than the first dielectric material of the one or more first dielectric layers. The filter apparatus may further include one or more thin-film metal layers arranged between at least one dielectric layer of the plurality of dielectric layers and an additional dielectric layer of the plurality of dielectric layers.
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