Invention Grant
- Patent Title: Photonic component
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Application No.: US16331956Application Date: 2017-09-01
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Publication No.: US11670909B2Publication Date: 2023-06-06
- Inventor: Stefan Meister , Hanjo Rhee
- Applicant: Sicoya GmbH
- Applicant Address: DE Berlin
- Assignee: SICOYA GMBH
- Current Assignee: SICOYA GMBH
- Current Assignee Address: DE Berlin
- Agency: Gordon Rees Scully Mansukhani, LLP
- Priority: DE 2016217749.4 2016.09.16
- International Application: PCT/DE2017/200088 2017.09.01
- International Announcement: WO2018/050180A 2018.03.22
- Date entered country: 2019-03-08
- Main IPC: H04B10/00
- IPC: H04B10/00 ; H01S5/14 ; G02B6/42 ; H01S5/02 ; G02B6/34 ; G02B6/12 ; G02B6/43 ; H01S5/10 ; H01L27/00 ; H01S5/02251 ; H01S5/40 ; H01S5/026

Abstract:
The invention relates to a photonic component (1) having at least one semiconductor laser amplifier (200), which has at least one first mirror surface (210a) for coupling and/or decoupling optical radiation (S). The first mirror surface (210a) of the semiconductor laser amplifier (200) is coupled to a photonically integrated chip (100), wherein the chip (100) is arranged such that the chip can emit optical radiation (S) from the chip top side (O100) thereof in the direction of the first mirror surface (210a) and couple said radiation in the semiconductor laser amplifier (200), and wherein the emitting of the radiation (S) away from the chip top side (O100) occurs in the direction of the first mirror surface (210a) at an angle of 90°±20°, in particular perpendicular, to the chip top side (O100).
Public/Granted literature
- US20190207368A1 PHOTONIC COMPONENT Public/Granted day:2019-07-04
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