Invention Grant
- Patent Title: Acoustic wave device, acoustic wave device package, radio-frequency front-end circuit, and communication device
-
Application No.: US17945139Application Date: 2022-09-15
-
Publication No.: US11671071B2Publication Date: 2023-06-06
- Inventor: Takuya Koyanagi , Hideki Iwamoto
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP 2017044686 2017.03.09
- Main IPC: H03H9/02
- IPC: H03H9/02 ; H03H9/145 ; H03H9/25

Abstract:
An acoustic wave device includes a silicon oxide film, a piezoelectric body, and an interdigital transducer electrode laminated on a support substrate made of silicon. Where a wave length that is determined by an electrode finger pitch of the interdigital transducer electrode is λ, a thickness of the support substrate is greater than or equal to about 3λ. An acoustic velocity of the first higher mode that propagates through the piezoelectric body is an acoustic velocity VSi=(V1)1/2 of bulk waves that propagate in the support substrate, which is determined by V1 out of solutions V1, V2, and V3 of x derived from the mathematical expression Ax3+Bx2+Cx+D=0, or higher than VSi.
Public/Granted literature
Information query