Invention Grant
- Patent Title: Multi-layer piezoelectric substrate with conductive layer
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Application No.: US16723819Application Date: 2019-12-20
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Publication No.: US11671072B2Publication Date: 2023-06-06
- Inventor: Rei Goto , Keiichi Maki
- Applicant: Skyworks Solutions, Inc.
- Applicant Address: US CA Irvine
- Assignee: Skyworks Solutions, Inc.
- Current Assignee: Skyworks Solutions, Inc.
- Current Assignee Address: US CA Irvine
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Main IPC: H03H9/02
- IPC: H03H9/02 ; H03H9/13 ; H03H9/64 ; H03H9/54 ; H03H3/08 ; H03H9/72 ; H10N30/05 ; H10N30/50 ; H10N30/87

Abstract:
An acoustic wave device is disclosed. The acoustic wave device can include a piezoelectric layer positioned over a substrate. The acoustic wave device can also include an interdigital transducer electrode positioned over the piezoelectric layer. The acoustic wave device can also include a grounding structure positioned over the piezoelectric layer. The acoustic wave device can also include a conductive layer positioned under the substrate such that the substrate is positioned between the conductive layer and the grounding structure. The acoustic wave device can further include an electrical pathway that electrically connects the conductive layer to the grounding structure.
Public/Granted literature
- US20200212883A1 MULTI-LAYER PIEZOELECTRIC SUBSTRATE WITH CONDUCTIVE LAYER Public/Granted day:2020-07-02
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