Invention Grant
- Patent Title: Decoupling capacitor circuits
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Application No.: US17410545Application Date: 2021-08-24
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Publication No.: US11671084B2Publication Date: 2023-06-06
- Inventor: Szu-Lin Liu , Jaw-Juinn Horng , Yi-Hsiang Wang , Wei-Lin Lai
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Hauptman Ham, LLP
- Main IPC: H03K5/12
- IPC: H03K5/12 ; H03K5/1252 ; H03K19/0185 ; H01L21/8234 ; H01L27/06 ; H01L29/94

Abstract:
An integrated circuit includes a first metal-insulator-semiconductor capacitor, a second metal-insulator-semiconductor capacitor, and a metal-insulator-metal capacitor. A first terminal of the first metal-insulator-semiconductor capacitor is configured to receive a first reference voltage for a higher voltage domain, while a first terminal of the second metal-insulator-semiconductor capacitor is configured to receive a second reference voltage for the higher voltage domain. A second terminal of the first metal-insulator-semiconductor capacitor is conductively connected to a first terminal of the metal-insulator-metal capacitor, while a second terminal of the second metal-insulator-semiconductor capacitor is conductively connected to a second terminal of the metal-insulator-metal capacitor. The first terminal of the metal-insulator-metal capacitor is configured to receive a first supply voltage for a lower voltage domain, and the first terminal of the second metal-insulator-semiconductor capacitor is configured to receive a second supply voltage for the lower voltage domain.
Public/Granted literature
- US20220360257A1 DECOUPLING CAPACITOR CIRCUITS Public/Granted day:2022-11-10
Information query
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