Invention Grant
- Patent Title: Multipart upload for distributed file systems
-
Application No.: US17017264Application Date: 2020-09-10
-
Publication No.: US11671492B2Publication Date: 2023-06-06
- Inventor: Takafumi Yonekura , Jason Kramberger
- Applicant: EMC IP Holding Company LLC
- Applicant Address: US MA Hopkinton
- Assignee: EMC IP HOLDING COMPANY LLC
- Current Assignee: EMC IP HOLDING COMPANY LLC
- Current Assignee Address: US MA Hopkinton
- Agency: Amin, Turocy & Watson, LLP
- Main IPC: H04L67/1097
- IPC: H04L67/1097 ; G06F16/182 ; H04L67/06

Abstract:
Described herein are technologies directed to multipart upload. A cluster coherent unique identifier for a multipart upload can be generated by creating a leaf in a B-tree. The leaf in the B-tree can comprise a key, and the key can comprise an upload identifier and a group identifier associated with a group of multipart uploads. A parts directory can be created for the multipart upload, wherein elements of the parts directory can be identified using the group identifier and the upload identifier. Upload parts can be transmitted from a client device to a server device, and stored in the parts directory. To complete the multipart upload, the upload parts can be concatenated and stored at a target location.
Public/Granted literature
- US20220078236A1 MULTIPART UPLOAD FOR DISTRIBUTED FILE SYSTEMS Public/Granted day:2022-03-10
Information query
IPC分类: