Provided is a speaker, including: a frame, a first diaphragm and a flexible printed circuit board connected to the frame. The first diaphragm includes a first surface close to the flexible printed circuit board and arranged opposite to the flexible printed circuit board. The first surface is recessed along a direction departing from the flexible printed circuit board to form a glue slot. The first surface is connected to the flexible printed circuit board by glue to enable the glue to enter the glue slot. A thickness of the glue at a glue junction is increased to enhance strength of connection between the flexible printed circuit board and the first diaphragm to ensure reliability of mounting of the flexible printed circuit board on the first diaphragm, which may reduce a failure rate of the speaker.