Invention Grant
- Patent Title: Micro-Electro-Mechanical System device
-
Application No.: US17422300Application Date: 2020-04-30
-
Publication No.: US11671765B2Publication Date: 2023-06-06
- Inventor: Yonggang Hu , Guoping Zhou , Changfeng Xia
- Applicant: CSMC TECHNOLOGIES FAB2 CO., LTD.
- Applicant Address: CN Wuxi
- Assignee: CSMC TECHNOLOGIES FAB2 CO., LTD.
- Current Assignee: CSMC TECHNOLOGIES FAB2 CO., LTD.
- Current Assignee Address: CN Jiangsu
- Agency: Dority & Manning, PA
- Priority: CN 1910392505.X 2019.05.13
- International Application: PCT/CN2020/087979 2020.04.30
- International Announcement: WO2020/228543A 2020.11.19
- Date entered country: 2021-07-12
- Main IPC: H04R19/00
- IPC: H04R19/00 ; H04R19/04 ; B81B7/02

Abstract:
A Micro-Electro-Mechanical System (MEMS) device includes a substrate, and a first sacrificial layer, a first conductive film, a second sacrificial layer, and a second conductive film successively laminated on the substrate, the second sacrificial layer being provided with a cavity; and further includes an amplitude-limiting layer provided with a first through hole and an isolation layer provided with a second through hole. The amplitude-limiting layer is located between the first conductive film and the first sacrificial layer and the isolation layer is located between the amplitude-limiting layer and the first conductive film, and/or the amplitude-limiting layer is located on the second conductive film and the isolation layer is located between the amplitude-limiting layer and the second conductive film. The amplitude-limiting layer extends to a projection region of an opening of the cavity and is in a suspended state.
Public/Granted literature
- US20220086571A1 MICRO-ELECTRO-MECHANICAL SYSTEM DEVICE Public/Granted day:2022-03-17
Information query