Invention Grant
- Patent Title: Removable electronics enclosure comprising at least one moveable heat spreader
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Application No.: US16811817Application Date: 2020-03-06
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Publication No.: US11672103B2Publication Date: 2023-06-06
- Inventor: Shankar Gopalakrishna , Saju Cheeran Verghese Francis , Vivekananda Avvaru
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM INCORPORATED
- Current Assignee: QUALCOMM INCORPORATED
- Current Assignee Address: US CA San Diego
- Agency: Loza & Loza, LLP
- Main IPC: F28F7/00
- IPC: F28F7/00 ; H05K7/20 ; H05K5/02
Abstract:
An electronics enclosure can be a line replaceable unit for installation in a chassis having actively cooled cold plates. The electronics enclosure has a housing, heat spreaders, and moveable heat spreaders. The electronics enclosure can be positioned in the chassis with the moveable heat spreaders close to the housing and thereafter the moveable heat spreaders can be moved away from the housing to press against the cold plates. Heat from electronics within the electronics enclosure can pass from the housing, through the heat spreaders, through the moveable heat spreaders, and into the cold plates.
Public/Granted literature
- US20210282300A1 REMOVABLE ELECTRONICS ENCLOSURE COMPRISING AT LEAST ONE MOVEABLE HEAT SPREADER Public/Granted day:2021-09-09
Information query
