Invention Grant
- Patent Title: Data center cooling using a heat pipe
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Application No.: US17127611Application Date: 2020-12-18
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Publication No.: US11672105B2Publication Date: 2023-06-06
- Inventor: Seung H. Park , Marco Antonio Magarelli , Veerendra Prakash Mulay , David Abad Cenizal , Jacob Na , Sarah E. Hanna
- Applicant: Meta Platforms, Inc.
- Applicant Address: US CA Menlo Park
- Assignee: Meta Platforms, Inc.
- Current Assignee: Meta Platforms, Inc.
- Current Assignee Address: US CA Menlo Park
- Agency: Van Pelt, Yi & James LLP
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
In one example, a heat pipe is configured to absorb and transfer heat away from ambient air of a data center to cool the ambient air circulating in the data center to cool devices of the data center, and a fluid interface is thermally coupled to the heat pipe and configured to cool the heat pipe via a coolant fluid circulating in the data center. In another example, a heat pipe configured to release transferred heat to air, and a fluid interface is thermally coupled to the heat pipe and configured to exchange heat to the heat pipe to cool a coolant fluid circulating in a data center to cool devices of the data center.
Public/Granted literature
- US20210227725A1 DATA CENTER COOLING USING A HEAT PIPE Public/Granted day:2021-07-22
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