Invention Grant
- Patent Title: Chassis with thermal transfer fluid path
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Application No.: US17360839Application Date: 2021-06-28
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Publication No.: US11672106B2Publication Date: 2023-06-06
- Inventor: Jason C. Duffy , Kenneth J. Trotman
- Applicant: Hamilton Sundstrand Corporation
- Applicant Address: US NC Charlotte
- Assignee: Hamilton Sundstrand Corporation
- Current Assignee: Hamilton Sundstrand Corporation
- Current Assignee Address: US NC Charlotte
- Agency: Kinney & Lange, P.A.
- Main IPC: H05K7/20
- IPC: H05K7/20 ; B64D37/34 ; H05K5/02

Abstract:
A chassis includes top rails extending along a top side of the chassis, bottom rails extending along a bottom side of the chassis, a fluid inlet connected to the chassis that is configured to receive a thermal transfer fluid, and a fluid outlet connected to the chassis that is configured to discharge the thermal transfer fluid. The chassis further includes a thermal transfer fluid path extending between and fluidly coupled to the fluid inlet and the fluid outlet, wherein the thermal transfer fluid is configured to flow through the thermal transfer fluid path, and wherein the thermal transfer fluid path extends in a serpentine pattern through at least one of the top rails and through at least one of the bottom rails.
Public/Granted literature
- US20220418170A1 CHASSIS WITH THERMAL TRANSFER FLUID PATH Public/Granted day:2022-12-29
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