Invention Grant
- Patent Title: Magnetic random access memory
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Application No.: US17346845Application Date: 2021-06-14
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Publication No.: US11672181B2Publication Date: 2023-06-06
- Inventor: Huang-Wen Tseng , Cheng-Chou Wu , Che-Jui Chang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McDermott Will & Emery LLP
- Main IPC: G11C11/16
- IPC: G11C11/16 ; H01L43/08 ; H01L43/02 ; H01L27/22 ; H01L43/10 ; H01L43/12 ; A61K8/55 ; A61K8/73 ; A61K8/86 ; A61Q11/00 ; G11C11/15 ; A61K8/34

Abstract:
A semiconductor device includes a magnetic random access memory (MRAM). The MRAM comprises a plurality of MRAM cells including a first type MRAM cell and a second type MRAM cell. Each of the plurality of MRAM cells includes a magnetic tunneling junction (MTJ) layer including a pinned magnetic layer, a tunneling barrier layer and a free magnetic layer. A size of the MTJ film stack of the first type MRAM cell is different from a size of the MTJ film stack of the second type MRAM cell. In one or more of the foregoing and following embodiments, a width of the MTJ film stack of the first type MRAM cell is different from a width of the MTJ film stack of the second type MRAM cell.
Public/Granted literature
- US20210313510A1 MAGNETIC RANDOM ACCESS MEMORY Public/Granted day:2021-10-07
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