Invention Grant
- Patent Title: Semiconductor device and manufacturing method of semiconductor device
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Application No.: US17369484Application Date: 2021-07-07
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Publication No.: US11672186B2Publication Date: 2023-06-06
- Inventor: Chien-Min Lee , Shy-Jay Lin , Yen-Lin Huang , MingYuan Song , Tung Ying Lee
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L43/00
- IPC: H01L43/00 ; H01L43/04 ; H01L43/14 ; H01L27/22 ; H01L43/10

Abstract:
Semiconductor device includes pair of active devices, composite spin Hall electrode, and a magnetic tunnel junction. Composite spin Hall electrode is electrically connected to pair of active devices. Magnetic tunnel junction is disposed on opposite side of composite spin hall electrode with respect to pair of active devices. Spin Hall electrode includes pair of heavy metal layers, and spacer layer disposed in between pair of heavy metal layers. Pair of heavy metal layers is made of a heavy metal in a metastable state. Spacer layer comprises first material different from the pair of heavy metal layers.
Public/Granted literature
- US11706999B2 Semiconductor device and manufacturing method of semiconductor device Public/Granted day:2023-07-18
Information query
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