A honeycomb structure, including: a plurality of pillar shaped honeycomb segments, each of the pillar shaped honeycomb segments including a partition wall and a plugged portion; and a joining layer arranged so as to join side surfaces of the pillar shaped honeycomb segments to each other. The honeycomb structure satisfies the following equations (1) to (3):

y≤1000  (1);

y≤717.92x−0.095  (2); and

y≥462.4x−0.153  (3),

in which y is a maximum temperature (° C.) at which the use of the honeycomb structure is accepted, and x is a thermal conduction factor represented by the following equation:

thermal conduction factor=(thermal conductivity of the partition wall×thermal conductivity of the joining layer)/(average thickness of the joining layer×porosity of the partition wall).