Invention Grant
- Patent Title: Composite molded body and production method therefor
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Application No.: US17263081Application Date: 2019-08-08
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Publication No.: US11673162B2Publication Date: 2023-06-13
- Inventor: Mitsuteru Mutsuda , Masaru Kitada
- Applicant: DAICEL-EVONIK LTD. , NAKANO MANUFACTURING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: DAICEL-EVONIK LTD.,NAKANO MANUFACTURING CO., LTD.
- Current Assignee: DAICEL-EVONIK LTD.,NAKANO MANUFACTURING CO., LTD.
- Current Assignee Address: JP Tokyo; JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP 2018151386 2018.08.10
- International Application: PCT/JP2019/031354 2019.08.08
- International Announcement: WO2020/032170A 2020.02.13
- Date entered country: 2021-01-25
- Main IPC: B05D7/24
- IPC: B05D7/24 ; B05D7/02 ; C08J7/04

Abstract:
The present invention provides a composite molded body in which a rubber layer in the form of a thin film is formed on a surface of a resin molded body and a production method therefor. According to an embodiment of the present invention, a liquid composition containing a rubber component such as a rubber latex and a peroxide is applied to a surface of a resin molded body such as a polyamide-based resin having an amino group, causing crosslinking to occur in an uncrosslinked rubber layer and forming a crosslinked rubber layer in the form of a thin film. When a co-crosslinking agent is used in combination, adhesion to the resin molded body can be improved even when the thickness of the crosslinked rubber layer is small.
Public/Granted literature
- US20210308719A1 COMPOSITE MOLDED BODY AND PRODUCTION METHOD THEREFOR Public/Granted day:2021-10-07
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