Invention Grant
- Patent Title: Three dimensional shaping method and three dimensional shaping apparatus
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Application No.: US17533157Application Date: 2021-11-23
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Publication No.: US11673338B2Publication Date: 2023-06-13
- Inventor: Tatsuya Okunaka , Haruka Ito , Fumitomo Takano , Mai Yokoi
- Applicant: HONDA MOTOR CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: HONDA MOTOR CO., LTD.
- Current Assignee: HONDA MOTOR CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Amin, Turocy & Watson, LLP
- Priority: JP 2020194970 2020.11.25
- Main IPC: B29C64/393
- IPC: B29C64/393 ; B29C64/118 ; B33Y50/02 ; B33Y10/00 ; B33Y30/00 ; B29C64/364 ; B29C64/20 ; B33Y40/00 ; B29C64/25
Abstract:
In a three dimensional shaping method and a three dimensional shaping apparatus, when a three dimensional object is obtained by laminating a resin material having thermoplasticity, the resin material is melted, and the melted resin material is laminated in a chamber to form resin layers. Next, the pressure in the chamber is adjusted to maintain the temperature of each of the resin layers within a predetermined temperature range in the chamber.
Public/Granted literature
- US20220161503A1 THREE DIMENSIONAL SHAPING METHOD AND THREE DIMENSIONAL SHAPING APPARATUS Public/Granted day:2022-05-26
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