Invention Grant
- Patent Title: Conductive structure having self-assembled protective layer and self-assembled coating composition
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Application No.: US16890089Application Date: 2020-06-02
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Publication No.: US11674049B2Publication Date: 2023-06-13
- Inventor: Lung-Pin Chen , Yi-Lung Yang , Chun-Hung Chu
- Applicant: TPK Universal Solutions Limited
- Applicant Address: HK Wanchai
- Assignee: TPK Universal Solutions Limited
- Current Assignee: TPK Universal Solutions Limited
- Current Assignee Address: HK Wanchai
- Agency: Cooper Legal Group, LLC
- Priority: CN 1911114973.7 2019.11.14
- Main IPC: C09D133/12
- IPC: C09D133/12 ; H01B5/14 ; B32B3/10 ; B32B15/09 ; C08K5/18

Abstract:
A conductive structure having a self-assembled protective layer and a self-assembled coating composition are provided. The self-assembled coating composition includes a resin, a solvent, and a self-assembled additive. The self-assembled additive includes alkylamine, fluoroalkylamine, fluoroaniline, or a derivative thereof. The self-assembled additive has a concentration in a range of from about 0.01 mg/L to about 100 mg/L in the self-assembled coating composition. The conductive structure includes a substrate, a conductive layer, and the self-assembled protective layer. The conductive layer is disposed over the substrate. The self-assembled protective layer covers the conductive layer and has a resin, a solvent, and the above-mentioned self-assembled additive.
Public/Granted literature
- US20210147706A1 CONDUCTIVE STRUCTURE HAVING SELF-ASSEMBLED PROTECTIVE LAYER AND SELF-ASSEMBLED COATING COMPOSITION Public/Granted day:2021-05-20
Information query
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