A substrate-free adhesive tape that is excellent in adhesive physical properties and is suitable for a continuous process is provided. The substrate-free adhesive tape includes a release film, and an adhesive layer provided on one surface of the release film and the adhesive layer containing a cured product of an adhesive composition, wherein when the release film is fixed on the outer surface of a semicircular tip part of a jig, the semicircular tip part having a radius of 22.5 mm, a breaking distance of the adhesive layer is 110 mm or less when the adhesive layer is stretched at a rate of 20 m/min from a semicircular center of the semicircular tip part toward an outermost direction of the semicircular tip part.