Invention Grant
- Patent Title: Structural adhesive compositions
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Application No.: US16507931Application Date: 2019-07-10
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Publication No.: US11674062B2Publication Date: 2023-06-13
- Inventor: Tien-Chieh Chao , Masayuki Nakajima , Hongying Zhou , Shanti Swarup , Umesh C. Desai
- Applicant: PPG Industries Ohio, Inc.
- Applicant Address: US OH Cleveland
- Assignee: PPG Industries Ohio, Inc.
- Current Assignee: PPG Industries Ohio, Inc.
- Current Assignee Address: US OH Cleveland
- Agent Alicia M. Passerin
- Main IPC: C09J163/00
- IPC: C09J163/00 ; C08G59/14 ; C08G59/40 ; C08G59/16 ; C08G59/44
Abstract:
An adhesive composition comprising an epoxy compound and a compound comprising at least one aminimide functional group is disclosed. The compound comprising the at least one aminimide functional group is present in an amount from 2-8% by weight based on total weight of the adhesive composition and reacts with the epoxy compound upon activation by an external energy source. The adhesive composition also may comprise an amidine salt.
Public/Granted literature
- US20190330502A1 STRUCTURAL ADHESIVE COMPOSITIONS Public/Granted day:2019-10-31
Information query
