Invention Grant
- Patent Title: Methods and apparatus for depositing aluminum by physical vapor deposition (PVD) with controlled cooling
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Application No.: US15930636Application Date: 2020-05-13
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Publication No.: US11674216B2Publication Date: 2023-06-13
- Inventor: Siew Kit Hoi , Yaoying Zhong , Xinxin Wang , Zheng Min Clarence Chong
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Moser Taboada
- Main IPC: C23C14/06
- IPC: C23C14/06 ; C23C14/34 ; C23C14/54

Abstract:
Methods and apparatus for performing physical vapor deposition in a reactor chamber to form aluminum material on a substrate including: depositing a first aluminum layer atop a substrate to form a first aluminum region having a first grain size and a first temperature; and cooling the first aluminum region atop a substrate to a second temperature at a rate sufficient to increase the first grain size to a second grain size.
Public/Granted literature
- US20210189545A1 METHODS AND APPARATUS FOR DEPOSITING ALUMINUM BY PHYSICAL VAPOR DEPOSITION (PVD) WITH CONTROLLED COOLING Public/Granted day:2021-06-24
Information query
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