Invention Grant
- Patent Title: Substrate processing apparatus
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Application No.: US15862190Application Date: 2018-01-04
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Publication No.: US11674225B2Publication Date: 2023-06-13
- Inventor: Hitoshi Kato , Yukio Ohizumi , Manabu Honma , Takeshi Kobayashi
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMTED
- Current Assignee: TOKYO ELECTRON LIMTED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer; Tanya E. Harkins
- Priority: JP 2017002881 2017.01.11
- Main IPC: C23C16/455
- IPC: C23C16/455 ; C23C16/458 ; C23C16/52 ; C23C14/50 ; C23C14/04 ; H01L21/304 ; H01L21/67 ; H01L21/687 ; C23C14/26 ; C23C14/22 ; B05C11/10 ; C23C16/40

Abstract:
There is provided a substrate processing apparatus for performing film formation by supplying a processing gas to a substrate, including: a rotary table provided in a processing container; a mounting stand provided to mount the substrate and configured to be revolved by rotating the rotary table; a processing gas supply part configured to supply a processing gas to a region through which the mounting stand passes by the rotation of the rotary table; a rotation shaft rotatably provided in a portion rotating together with the rotary table and configured to support the mounting stand; a driven gear provided on the rotation shaft; a driving gear provided along an entire circumference of a revolution trajectory of the driven gear to face the revolution trajectory of the driven gear and configured to constitute a magnetic gear mechanism with the driven gear; and a rotating mechanism configured to rotate the driving gear.
Public/Granted literature
- US20180195173A1 Substrate Processing Apparatus Public/Granted day:2018-07-12
Information query
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