Invention Grant

  • Patent Title: Heat pump
  • Application No.: US16767125
    Application Date: 2018-12-28
  • Publication No.: US11674725B2
    Publication Date: 2023-06-13
  • Inventor: Ji Yang
  • Applicant: Ji Yang
  • Applicant Address: CN Hunan
  • Assignee: Ji Yang
  • Current Assignee: Ji Yang
  • Current Assignee Address: CN Hunan
  • Agency: JCIPRNET
  • Priority: CN 1711469300.4 2017.12.29
  • International Application: PCT/CN2018/124818 2018.12.28
  • International Announcement: WO2019/129195A 2019.07.04
  • Date entered country: 2020-05-27
  • Main IPC: F25B47/02
  • IPC: F25B47/02 F24D3/18 F24H4/02 F25B13/00 F25B30/02 F25B41/22
Heat pump
Abstract:
A device for heating by absorbing latent heat of solidification of water, including a compressor (1), a condenser (2) and multiple evaporators (E1, E2) connected in parallel, each evaporator (E1, E2) has an electronic expansion valve (D1, D2) at its inlet, a solenoid valve (V1, V2) at its outlet; after the evaporators (E1, E2) are connected in parallel, outlets of the evaporators (E1, E2) are connected to an inlet of the compressor (1) and inlets of the evaporators (E1, E2) are connected to an outlet of the condenser (2); an outlet of the compressor (1) is connected to an inlet of the condenser (2); the compressor (1), the condenser (2) and the multiple parallel evaporators (E1, E2) form a closed loop system through pipelines; there are circulating refrigerants in the closed loop system, and heating and deicing processes are realized through a circulation of refrigerants; the solenoid valves (V1, V2) at the outlets of the evaporators (E1, E2) are switched between opening or closing to realize switching between evaporating and deicing functions of the evaporators (E1, E2).
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