Invention Grant
- Patent Title: Terahertz plasmonics for testing very large-scale integrated circuits under bias
-
Application No.: US17121851Application Date: 2020-12-15
-
Publication No.: US11675002B2Publication Date: 2023-06-13
- Inventor: Greg Rupper , John Suarez , Sergey Rudin , Meredith Reed , Michael Shur
- Applicant: The Government of the United States, as represented by the Secretary of the Army
- Applicant Address: US DC Washington
- Assignee: The Government of the United States, as represented by the Secretary of the Army
- Current Assignee: The Government of the United States, as represented by the Secretary of the Army
- Current Assignee Address: US DC Washington
- Agent Ronald Krosky
- The original application number of the division: US15437713 2017.02.21
- Main IPC: G01R31/311
- IPC: G01R31/311 ; G01R31/265 ; G01R31/3185 ; G01R31/28

Abstract:
Various embodiments are described that relate to failure determination for an integrated circuit. An integrated circuit can be tested to determine if the integrated circuit is functioning properly. The integrated circuit can be subjected to a specific radiation such that the integrated circuit produces a response. This response can be compared against an expected response to determine if the response matches the expected response. If the response does not match the expected response, then the integrated circuit fails the test. If the response matches the expected response, then the integrated circuit passes the test.
Public/Granted literature
- US20220011363A1 Terahertz Plasmonics for Testing Very Large-Scale Integrated Circuits under Bias Public/Granted day:2022-01-13
Information query