- Patent Title: Composition for forming resist overlayer film for EUV lithography
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Application No.: US13880470Application Date: 2011-09-15
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Publication No.: US11675269B2Publication Date: 2023-06-13
- Inventor: Rikimaru Sakamoto , Bangching Ho , Takafumi Endo
- Applicant: Rikimaru Sakamoto , Bangching Ho , Takafumi Endo
- Applicant Address: JP Toyama
- Assignee: NISSAN CHEMICAL INDUSTRIES, LTD.
- Current Assignee: NISSAN CHEMICAL INDUSTRIES, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP 2010236121 2010.10.21
- International Application: PCT/JP2011/071139 2011.09.15
- International Announcement: WO2012/053302A 2012.04.26
- Date entered country: 2013-04-19
- Main IPC: G03F7/11
- IPC: G03F7/11 ; C08L61/06 ; C08G8/08 ; C09D161/06 ; G03F7/09 ; C08G8/24 ; C09D5/00 ; C08F12/24 ; C08F212/14

Abstract:
There is provided a composition for forming an EUV resist overlayer film that is used in an EUV lithography process, that does not intermix with the EUV resist, that blocks unfavorable exposure light for EUV exposure, for example, UV light and DUV light and selectively transmits EUV light alone, and that can be developed with a developer after exposure. A composition for forming an EUV resist overlayer film used in an EUV lithography process including a resin containing a naphthalene ring in a main chain or in a side chain and a solvent, in which the resin may include a hydroxy group, a carboxy group, a sulfo group, or a monovalent organic group having at least one of these groups as a hydrophilic group.
Public/Granted literature
- US20130209940A1 COMPOSITION FOR FORMING RESIST OVERLAYER FILM FOR EUV LITHOGRAPHY Public/Granted day:2013-08-15
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