Invention Grant
- Patent Title: Substrate support with real time force and film stress control
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Application No.: US17095577Application Date: 2020-11-11
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Publication No.: US11676802B2Publication Date: 2023-06-13
- Inventor: Wendell Glenn Boyd, Jr. , Govinda Raj , Matthew James Busche
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: G01D5/26
- IPC: G01D5/26 ; H01J37/32 ; H01L21/683 ; C23C16/458 ; G01L11/02 ; G01D11/24

Abstract:
Embodiments disclosed herein include a substrate support having a sensor assembly, and processing chamber having the same. In one embodiment, a substrate support has a puck. The puck has a workpiece support surface and a gas hole exiting the workpiece support surface. A sensor assembly is disposed in the gas hole and configured to detect a metric indicative of a deflection of a workpiece disposed on the workpiece support surface, wherein the sensor assembly is configured to provide the benefit of allowing gas to flow past the sensor assembly when positioned in the gas hole.
Public/Granted literature
- US20210066038A1 SUBSTRATE SUPPORT WITH REAL TIME FORCE AND FILM STRESS CONTROL Public/Granted day:2021-03-04
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