Invention Grant
- Patent Title: Method for pitch split patterning using sidewall image transfer
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Application No.: US16916452Application Date: 2020-06-30
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Publication No.: US11676817B2Publication Date: 2023-06-13
- Inventor: Akiteru Ko , Richard Farrell
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/033
- IPC: H01L21/033 ; G03F7/09 ; G03F7/11 ; G03F7/20 ; G03F7/26 ; H01L21/027

Abstract:
A method of forming a device includes forming a hard mask layer over an underlying layer of a substrate, forming an anti-reflective coating layer over the hard mask layer, forming a patterned resist layer over the anti-reflective coating layer, and forming a mandrel including the anti-reflective coating layer by patterning the anti-reflective coating layer using the patterned resist layer as an etch mask. The method includes forming a sidewall spacer on the mandrel including the anti-reflective coating layer, forming a freestanding spacer on the hard mask layer by removing the mandrel from the anti-reflective coating layer, and using the freestanding spacer as an etch mask, patterning the underlying layer of the substrate.
Public/Granted literature
- US20210407804A1 METHOD FOR PITCH SPLIT PATTERNING USING SIDEWALL IMAGE TRANSFER Public/Granted day:2021-12-30
Information query
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