Invention Grant
- Patent Title: Semiconductor manufacturing apparatus and manufacturing method of semiconductor device
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Application No.: US17119431Application Date: 2020-12-11
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Publication No.: US11676828B2Publication Date: 2023-06-13
- Inventor: Shinsuke Muraki , Satoshi Nakaoka
- Applicant: Kioxia Corporation
- Applicant Address: JP Tokyo
- Assignee: Kioxia Corporation
- Current Assignee: Kioxia Corporation
- Current Assignee Address: JP Tokyo
- Agency: Obion, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP 2020046623 2020.03.17
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/311 ; H01L21/66

Abstract:
A semiconductor manufacturing apparatus according to the present embodiment includes a tank, a heater, a bubble supplier, a sensor and a controller. The tank stores a chemical solution for processing a substrate. The heater heats the chemical solution. The bubble supplier supplies bubbles to the chemical solution in the tank. The sensor detects at least one of a concentration of the chemical solution, a water concentration of the chemical solution, specific gravity of the chemical solution and a vapor concentration of a gas discharged from the tank. The controller controls the supply of bubbles by the bubble supplier based on a detection result of the sensor.
Public/Granted literature
- US20210296143A1 SEMICONDUCTOR MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE Public/Granted day:2021-09-23
Information query
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