Invention Grant
- Patent Title: Wafer cassette
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Application No.: US17186980Application Date: 2021-02-26
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Publication No.: US11676838B2Publication Date: 2023-06-13
- Inventor: Chao-Chih Wang , Ya-Nan Wang , Chia-He Wu , Cheng-Han Chiang
- Applicant: VisEra Technologies Company Limited
- Applicant Address: TW Hsin-Chu
- Assignee: VISERA TECHNOLOGIES COMPANY LIMIIED
- Current Assignee: VISERA TECHNOLOGIES COMPANY LIMIIED
- Current Assignee Address: TW Hsin-Chu
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H01L21/673
- IPC: H01L21/673 ; H01L21/32
Abstract:
A wafer cassette for receiving a wafer is provided. The wafer cassette includes a cassette housing, a first supporting rib and a second supporting rib. The first supporting rib is disposed in the cassette housing, wherein the first supporting rib includes a front supporting portion, a middle supporting portion and a rear supporting portion, the front supporting portion is connected to one end of the middle supporting portion, the rear supporting portion is connected to the other end of the middle supporting portion, and the front supporting portion has a front curved edge. The second supporting rib is disposed in the cassette housing. An edge portion of the wafer is supported by the first supporting rib and the second supporting rib, and the front supporting portion, the middle supporting portion and the rear supporting portion contact the wafer simultaneously.
Public/Granted literature
- US20220277967A1 WAFER CASSETTE Public/Granted day:2022-09-01
Information query
IPC分类:
