A semiconductor device includes: first and second core regions; first and second input/output (I/O) regions coupled to each other and to the first and second core regions; the first and second I/O regions being between an expendable region and correspondingly the first and second core regions; a sealing ring surrounding the core regions and the I/O regions; metallization layers and interconnection layers; inter-communication (inter-com) segments extending between the I/O regions; first and second parapets which extend from the first to third sides of the sealing ring or from first to second locations on corresponding third and fourth parapets, the latter extending from the first to third sides of the sealing ring; the first parapet being between the first core region and the first I/O region; and the second parapet being between the second core region and the second I/O region.