Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16448166Application Date: 2019-06-21
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Publication No.: US11676995B2Publication Date: 2023-06-13
- Inventor: Masato Izumi , Kazutoshi Nakamura
- Applicant: Kabushiki Kaisha Toshiba , Toshiba Electronic Devices & Storage Corporation
- Applicant Address: JP Tokyo
- Assignee: KABUSHIKI KAISHA TOSHIBA,TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
- Current Assignee: KABUSHIKI KAISHA TOSHIBA,TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
- Current Assignee Address: JP Tokyo; JP Tokyo
- Agency: Allen & Overy LLP
- Priority: JP 2019042446 2019.03.08
- Main IPC: H01L29/47
- IPC: H01L29/47 ; H01L29/06 ; H01L29/36 ; H01L29/872

Abstract:
A semiconductor device includes a semiconductor body, an electrode provided on a surface of the semiconductor body. The semiconductor body includes a first semiconductor layer and a second semiconductor layer provided between the first semiconductor layer and the second electrode. The second semiconductor layer includes first and second regions arranged along the surface of the semiconductor body. The first region has a surface contacting the electrode, and the second region includes second conductivity type impurities with a concentration lower than a concentration of the second conductivity type impurities at the surface of the first region. The second semiconductor layer has a first concentration of second conductivity type impurities at a first position in the second region, and a second concentration of second conductivity type impurities at a second position between the first position and the electrode, the second concentration being lower than the first concentration.
Public/Granted literature
- US20200286989A1 SEMICONDUCTOR DEVICE Public/Granted day:2020-09-10
Information query
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