Invention Grant
- Patent Title: Semiconductor structure and method of forming thereof
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Application No.: US17321255Application Date: 2021-05-14
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Publication No.: US11677022B2Publication Date: 2023-06-13
- Inventor: Yi-Huan Chen , Chien-Chih Chou , Szu-Hsien Liu , Kong-Beng Thei , Huan-Chih Yuan , Jhu-Min Song
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT Law
- Agent Anthony King
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/66 ; H01L29/423 ; H01L29/06

Abstract:
A semiconductor structure and a method for forming a semiconductor structure are provided. The semiconductor structure includes a substrate; a gate electrode disposed within the substrate; a gate dielectric layer disposed within the substrate and surrounding the gate electrode; a plurality of first protection structures disposed over the gate electrode; a second protection structure disposed over the gate dielectric layer; and a pair of source/drain regions on opposing sides of the gate dielectric layer.
Public/Granted literature
- US20220367709A1 SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THEREOF Public/Granted day:2022-11-17
Information query
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