Invention Grant
- Patent Title: Method of manufacturing light source device having a bonding layer with bumps and a bonding member
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Application No.: US16724995Application Date: 2019-12-23
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Publication No.: US11677062B2Publication Date: 2023-06-13
- Inventor: Takashi Matsumoto , Naoki Harada , Fukutaro Saegusa , Yoshiyuki Kageyama
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP 2018240933 2018.12.25 JP 2019110484 2019.06.13
- Main IPC: H01L33/64
- IPC: H01L33/64 ; H01L33/00 ; H01L23/00 ; H01L33/62
Abstract:
A method of manufacturing a light source device includes: disposing bumps containing a first metal on a first substrate which is thermally conductive; disposing a bonding member on the bumps, the bonding member containing Au—Sn alloy; disposing a light emitting element on the bumps and the bonding member; and heating the first substrate equipped with the bumps, the bonding member, and the light emitting element.
Information query
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