Invention Grant
- Patent Title: Circuit board assembly and electronic device including the same
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Application No.: US16659075Application Date: 2019-10-21
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Publication No.: US11677132B2Publication Date: 2023-06-13
- Inventor: Jongwon Lee , Dongil Son
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: The Farrell Law Firm, P.C.
- Priority: KR 20180125148 2018.10.19
- Main IPC: H01Q1/22
- IPC: H01Q1/22 ; H05K1/02 ; H05K1/14 ; H01Q1/02 ; H05K9/00 ; H05K1/11 ; H05K1/18 ; H01Q23/00

Abstract:
Disclosed is an antenna module including a circuit board, a communication circuit disposed on one surface of the circuit board, one or more antenna elements electrically connected to the communication circuit and arranged in at least a part of the circuit board, and a connection circuit board which includes an at least partially covered opening and is disposed on the one surface of the circuit board such that the communication circuit is disposed in an inner space of the connection circuit board.
Information query